Organic-Inorganic hybrid resin [COMPOCERAN]

Organic and inorganic hybrid resin made by bonding nano silica to resins

This is made by bonding silica(glass) to resins. Our own hybrid technologies can produce a new material showing higher heat resistance and adhesion. It has these properties as a result of inheriting the advantages of both the organic and inorganic components. Since the particle diameter of the silica material is as small as several nanometers, it looks homogeneous and transparent.

For example, the Epoxy Resin Silica Hybrid [COMPOCERAN E] has a special portion that causes only the part -- the heat susceptible epoxy resin (base resin)-- to change to silica when it is heated. The silica produced by hardening can protect the heat susceptible part. Though the silica component accounts for only 30w/w% of content, the material is able to transform to a glass-like hard, Tg-less substance.

 

Molecular structure

 

Heat resistance

Product lineups

COMPOCERAN E (Epoxy Resin Silica Hybrid)

Product Base Resin Number of Functional
Group of Silica
Solvent Solid
Content (%)
Viscosity
(mPa・s)
(25℃)
Silica
Content
%(wt%)
Characteristics
E103A Bisphenol-A Epoxy 3 DMDG 50 15 35 No Tg, Low absorption
E103D MEK

COMPOCERAN H800 (Polyamic Acid Silica Hybrid)

Product Base Resin Number of Functional
Group of Silica
Solvent Solid
Content (%)
Viscosity
(mPa・s)
(25℃)
Silica
Content
%(wt%)
Characteristics
(※refrigeration keeping necessary)
H801D Polyamic Acid 4 DMAc 15 8,000 2 Good adhesion to metal, Suitable for Non-electroplating(* frozen storage needed)

COMPOCERAN SQ (Sil-sesqui-oxane type Hybrid)

Product Functional group Solvent Solid
Content (%)
Viscosity
(mPa・s)
(25℃)
Silica
Content
%(wt%)
Characteristics
SQ107 Thiol DMG/Toluene 72 50 44 High refraction index, Transparent, Flexibility (Heat curable and UV curable are available)
SQ109 Thiol PGMEA 25 3 44 High b.p. solvent type of SQ107
SQ506 Epoxy PGMEA 200 35 Transparency (*frozen storage needed)
SQ502-8 IPA/Toluene 70 50 Good adhesion to non-organic material.
Transparency

COMPOCERAN AC (Acrylic Silica Hybrid)

Product Base Resin Number of Functional
Group of Silica
Solvent Solid
Content (%)
Viscosity
(mPa・s)
(25℃)
Silica
Content
%(wt%)
Characteristics
AC601 PMMA 4 MIBK/MeOH 25 50 15 Transparency, Weather resistance

COMPOCERAN AI (Polyamideimide)

Product Base Resin Solvent Solid
Content (%)
Viscosity
(mPa・s)
(25℃)
Silica
Content
%(wt%)
Characteristics
AI301 High Mw Polyamideimide NMP 19 8,000 0 General purpose, Flexibility

PIAD (Thermoplastic Polyimide Solution)

Product Base Resin Solvent Solid
Content (%)
Viscosity
(mPa・s)
(25℃)
Appearance Characteristics
PIAD100H High Mw Polyimide Anone/MCH 30 500 Deep Orange Transparent Adhesives for PCB, Good Flexibility and adhesivity, Low dielectric charateristic
PIAD100L Low Mw Polyimide Anone/MCH 30 300 Deep Orange Transparent Adhesives for PCB, Good compatibility and flexibility, Low dielectric charateristic
PIAD200 High Mw Polyimide Anone/MCH/DMG 30 1,000 Yellow Transparent Adhesives for PCB, High Tg and good compatibility, Low dielectric charateristic
PIAD300 Medium Mw Polyimide Anone/MCH/DMG 30 500 Yellow Transparent Adhesives for PCB, High Tg and good compatibility
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