Hybrid Polyimide Film [POMIRAN]

Polyimide film of homogeneously dispersed nanosilica particles [POMIRAN]

A joint project between Taimide Technology Inc. (Taiwan) and our company developed and commercialized a silica-hybrid polyimide film. It has a special structure in which nanosilica particles with an average diameter of 5 nm are dispersed in a polyimide matrix, named POMIRAN. A fusion between our company's hybrid material technologies and Taimide Technology Inc.'s filming technologies resulted in the development of this material.

A transmission electron microscope (TEM) image of this material shows that silica particles with a diameter of about 5 nm are uniformly dispersed in a resin. The silica particles are very small so that, unlike filler or glass cloth composited films, no asperity or haze occurs on the surface of the film.

POMIRAN can be coated with a metallic seed layer in a wet plating process that has been considered not applicable for forming such a layer on a polyimide film. The metallic seed layer formed on POMIRAN shows a higher adhesion and durability. The nano silica particles are chemically bonded to the polyimide resin. They form a three-dimensional crosslinked structure that shows a higher temperature and humidity resistance, meaning that a higher dimensional stability can be obtained. POMIRAN N has a coefficient of thermal expansion similar to that of copper and SUS metals. POMIRAN T has a coefficient of thermal expansion similar to that of silicon and glass. The nanosilica particles are effective for preventing metallic ions from diffusing, and thus they improve the ionic migration resistance. These features of POMIRAN will likely prove very useful for electronic circuit boards that will be required to have finer pitches than ever. Note that the silica particles contained do not compromise the polyimide's fire retardancy, heat resistance or insulating capability.

POMIRAN
POMIRAN
POMIRAN plated
POMIRAN plated
Plated layer (sectional view)
Plated layer (sectional view)
TEM image of POMIRAN
TEM image of POMIRAN

 

Product lineups

Product Component Thickness(μ) Width (mm) CTE
(ppm/℃)
UL Characteristics
T Silica Hybrid Polyimide 12,15,25,38 250-1,100 4 94V-0 Good adhesion to Metal, Dimensional stability.
Antimigration, Suitable for semiadditive process
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