Products
Solder for use in electronics
[PINE SOLDER]
[PINE FLUX]
Solder with our own rosin-based flux
Our flux technologies
Rosin is made by refining the sap (crude turpentine) of pine trees.
For more than 135 years since our company's establishment, we have been manufacturing various rosin-based products including printing chemicals, printing ink, tackifiers and adhesives. Our recent strategies focusing on the electronic industry are encouraging the development of rosin-based unique flux for electronic applications.
1. Solder Paste [PINE SOLDER]
This is a special, lead-free solder paste containing our own rosin-based unique flux. The product lineup shown below allows you to choose the optimum ones for individual applications
- For automobile onboard electronic devices
Automobile electronic parts and other high-reliability parts
Product: GSP (new product), AC240 and PSP-P293R1
- For high-quality general applications
Commercial use electronic parts
Product: PINE SOLDER VAPY and XFP series (halogen free)
- For pre-solder
Semiconductor packages, interposers and solder coating
Product: PINE SOLDER TAS LF 219Y series
Product lineups
PINE SOLDER (Solder Paste)
| Product | Type | Metal | Powder Size |
Viscosity (mPa･s)(25℃) |
Halide Content (wt%) |
Application |
|---|---|---|---|---|---|---|
| GSP | Pb-Free | Sn3.0Ag0.5Cu | Type 4 | 130-190 | 0.06 | Automotive PCB |
| PSP-V | 〃 | 〃 | 〃 | 160-220 | 0.24 | 〃 |
| VAPY LF219 | 〃 | 〃 | 〃 | 160-240 | 0.07 | PCB |
| XFP LF138 | Low melting point, Halogen-Free | Sn58Bi | 〃 | 140-200 | None | 〃 |
| VAPY-F | Pb-Free | Sn3.0Ag.0.5Cu | Type 5 | 160-240 | ＜0.01 | 〃 |
| PSP-F | Pb-Free, Halogen-Free | 〃 | 〃 | 150-210 | None | 〃 |
| TAS LF219T | Pre-coat Solder | Sn3.0Ag.0.5Cu | Type 7 | 80-140 | 0.14-0.20 | Interposer |
2. Rosin contained wire solder [PINE SOLDER]
Our own flux technologies brought about a significant reduction of flux scattering, which resulted in the development of this high-performance, lead-free wire solder containing rosin that has a better wettability. A halogen-free version is also available.
Product: PINE SOLDER PSC-K31A and PSC-CK3 (halogen-free)
3. Post flux [PINE FLUX]
Rosin-based flux for various applications including special ones
- Rosin-based post flux for flow
General purpose; applicable for lead-free solder with a low content of silver or no silver Product: PINE FLUX WHS series
Product: PINE FLUX WHS series
- Post flux for terminals
Coils and transformers
Product: PINE FLUX NLD series
- Post flux for semiconductors
Bumping, solder balls and LED elements
Product: PINE FLUX WHD, WHP and ALS series
Product lineups
PINE FLUX
| Product | Apply Method | Appearance |
Viscosity (mPa･s)(20℃) |
Solid Content (wt%) |
Halide Content (wt%) | Application |
|---|---|---|---|---|---|---|
| WHD-001 | Spin Coat | Pale Yellow | 14 | 40 | None | Wafer Bump |
| WHP-002 | Print/Pin Transfer | Dark Brown | 9 | 70 | 〃 | Wafer Bump, Flip Chip |
| WHP-121 | Pale yellow | 100 | 70 | ＜0.05 | Interposer, Wafer bump,flip chip | |
| WHS-003C | Spray | 〃 | - | 15 | 0.08 | PCB |
| WHD-004HF | Dip | 〃 | - | 28 | None | Terminal |
| WHP-123 | 〃 | 75000 | 88 | ＜0.05 | Interposer, Wafer bump, flip chip, Au pad | |
| WHP-125 | 〃 | 〃 | 〃 | 90 | 〃 | Interposer, Wafer bump, flip chip, OSP pad |
| WSP-015R-6 | 〃 | 〃 | 13000 | 100 | None | Interposer, Wafer bump, flip chip |
| WSP-071-2 | 〃 | 〃 | 45000 | 87 | 〃 | 〃 |
| WSP-230 | transfer | 〃 | 2000 | 100 | 〃 | chip connection |
| WSP-281 | 〃 | 〃 | 5000 | 76 | 〃 | chip or interposer connection |
Inquiry about Product
Fine Chemicals & Electronics Div.
Electronic Materials Dept.
TEL【Osaka】+81-6-6209-8617
9:00 to 17:30（Except Saturday,Sunday,National holidays and year-end through New Year Holidays）