Products

Organic-Inorganic hybrid resin
[COMPOCERAN]

Organic and inorganic hybrid resin made by bonding nano silica to resins

・Excellent heat resistance, adhesion, etc. that combine the advantages of organic materials and inorganic materials by proprietary compounding method
・As the particle diameter of the silica material is as small as several nanometers, it looks homogeneous and transparent
・Silica produced by hardening, can protect the heat susceptible part of the resin, to transform to a glass-like hard Tg-less substance

 

Molecular structure

 

Heat resistance

Product lineups

COMPOCERAN E (Epoxy Resin Silica Hybrid)

Product Base Resin Number of Functional
Group of Silica
Solvent Solid
Content (%)
Viscosity
(mPa・s)
(25℃)
Silica
Content
%(wt%)
Characteristics
E103A Bisphenol-A Epoxy 3 DMDG 50 15 35 No Tg, Low absorption
E103D MEK

COMPOCERAN SQ (Sil-sesqui-oxane type Hybrid)

        

Product Functional group Solvent Solid
Content (%)
Viscosity
(mPa・s)
(25℃)
Silica
Content
%(wt%)
Characteristics
SQ107 Thioi DMG/Toluene 72 50 44 High refraction index,transparent,flexibility
(Heat/UV curable types available)
SQ109 Thioi PGMEA 25 3 44 High boiling point solvent of SQ107
SQ506 Epoxy PGMEA 72 200 35 Transparency,high reactivity(*frozen storage required)
SQ502-8 IPA/Toluene 70 50 Good adhesion to non-organic material.
Transparency

COMPOCERAN AI (Polyamideimide)

Product Base Resin Solvent Solid
Content (%)
Viscosity
(mPa・s)
(25℃)
Silica
Content
%(wt%)
Characteristics
AI301 High Mw Polyamideimide NMP 19 8,000 0 General purpose, Flexibility

Inquiry about Product

Fine Chemicals & Electronics Div.
Electronic Materials Dept.

TEL【Osaka】+81-6-6209-8617

9:00 to 17:30(Except Saturday,Sunday,National holidays and year-end through New Year Holidays)